Item type |
学術雑誌論文 / Journal Article(1) |
公開日 |
2008-04-01 |
タイトル |
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タイトル |
Effect of Zn Addition to Sn-3Ag-5Bi Solder on Joint Strength and Joint Interface |
言語 |
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言語 |
eng |
キーワード |
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主題Scheme |
Other |
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主題 |
Lead-free solder |
キーワード |
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主題Scheme |
Other |
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主題 |
Zn addition |
キーワード |
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主題Scheme |
Other |
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主題 |
Joint strength |
キーワード |
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主題Scheme |
Other |
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主題 |
Reaction layer |
キーワード |
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主題Scheme |
Other |
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主題 |
Joint interface structure |
資源タイプ |
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資源タイプ識別子 |
http://purl.org/coar/resource_type/c_6501 |
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資源タイプ |
journal article |
著者 |
Nakahara, Yuunosuke
Ninomiya, Ryuuji
Tagami, Michihiro
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内容記述(抄録) |
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内容記述タイプ |
Other |
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内容記述 |
The mechanical properties and the joint strength of Sn-Ag-Bi solders as replacement solders for Sn-Pb eutectic solder were investigated. The joint strength between Cu sheets and solder decreases when more than 5 mass% Bi is added to Sn-Ag system solders afterannealing. Zn addition to Sn-3Ag-5Bi solderis carried out in order to improve the joint strength. The effectof Zn addition to Sn-3Ag-5Bi solder on the joint strength and the joint interface structure was investigated. Zn addition to Sn-3Ag-5Bi solder changes the joint interface structure from solder/Cu-Sn intermetallic compounds/Cu to solder/Cu-Zn intermetallic compound/Cu-Sn intermetallic compound/Cu. Cu-Zn intermetallic compound acts as a barrier layer for inhibiting the growth of Cu-Sn reactionlayer. Therefore, the growth of reactionlayer and decrease ofjoint strength are inhibited by Zn addition after annealing. |
著者版フラグ |
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出版タイプ |
VoR |
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出版タイプResource |
http://purl.org/coar/version/c_970fb48d4fbd8a85 |
DOI |
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関連タイプ |
isIdenticalTo |
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識別子タイプ |
DOI |
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関連識別子 |
10.5188/ijsmer.10.142 |
書誌情報 |
International Journal of the Society of Materials Engineering for Resources
巻 10,
号 2,
p. 142-146,
発行日 2002-09-01
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ISSN |
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収録物識別子タイプ |
ISSN |
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収録物識別子 |
13479725 |
NCID |
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収録物識別子タイプ |
NCID |
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収録物識別子 |
AA1095475X |
出版者 |
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出版者 |
The Society of Materilas Engineering for resources of Japan |
関連リンク |
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識別子タイプ |
DOI |
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関連識別子 |
http://doi.org/10.5188/ijsmer.10.142 |