@article{oai:air.repo.nii.ac.jp:00000965,
 author = {Nakahara, Yuunosuke and Ninomiya, Ryuuji and Tagami, Michihiro},
 issue = {2},
 journal = {International Journal of the Society of Materials Engineering for Resources},
 month = {Sep},
 note = {The mechanical properties and the joint strength of Sn-Ag-Bi solders as replacement solders for Sn-Pb eutectic solder were investigated. The joint strength between Cu sheets and solder decreases when more than 5 mass% Bi is added to Sn-Ag system solders afterannealing. Zn addition to Sn-3Ag-5Bi solderis carried out in order to improve the joint strength. The effectof Zn addition to Sn-3Ag-5Bi solder on the joint strength and the joint interface structure was investigated. Zn addition to Sn-3Ag-5Bi solder changes the joint interface structure from solder/Cu-Sn intermetallic compounds/Cu to solder/Cu-Zn intermetallic compound/Cu-Sn intermetallic compound/Cu. Cu-Zn intermetallic compound acts as a barrier layer for inhibiting the growth of Cu-Sn reactionlayer. Therefore, the growth of reactionlayer and decrease ofjoint strength are inhibited by Zn addition after annealing.},
 pages = {142--146},
 title = {Effect of Zn Addition to Sn-3Ag-5Bi Solder on Joint Strength and Joint Interface},
 volume = {10},
 year = {2002}
}