{"created":"2023-07-25T10:21:49.049720+00:00","id":965,"links":{},"metadata":{"_buckets":{"deposit":"5ec215de-d33e-445e-8982-cf6441bae40d"},"_deposit":{"created_by":3,"id":"965","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"965"},"status":"published"},"_oai":{"id":"oai:air.repo.nii.ac.jp:00000965","sets":["590:664:671:683"]},"author_link":["3409","3407","3408"],"item_10001_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2002-09-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"2","bibliographicPageEnd":"146","bibliographicPageStart":"142","bibliographicVolumeNumber":"10","bibliographic_titles":[{"bibliographic_title":"International Journal of the Society of Materials Engineering for Resources"}]}]},"item_10001_description_5":{"attribute_name":"内容記述（抄録）","attribute_value_mlt":[{"subitem_description":"The mechanical properties and the joint strength of Sn-Ag-Bi solders as replacement solders for Sn-Pb eutectic solder were investigated. The joint strength between Cu sheets and solder decreases when more than 5 mass% Bi is added to Sn-Ag system solders afterannealing. Zn addition to Sn-3Ag-5Bi solderis carried out in order to improve the joint strength. The effectof Zn addition to Sn-3Ag-5Bi solder on the joint strength and the joint interface structure was investigated. Zn addition to Sn-3Ag-5Bi solder changes the joint interface structure from solder/Cu-Sn intermetallic compounds/Cu to solder/Cu-Zn intermetallic compound/Cu-Sn intermetallic compound/Cu. Cu-Zn intermetallic compound acts as a barrier layer for inhibiting the growth of Cu-Sn reactionlayer. Therefore, the growth of reactionlayer and decrease ofjoint strength are inhibited by Zn addition after annealing.","subitem_description_type":"Other"}]},"item_10001_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"The Society of Materilas Engineering for resources of Japan"}]},"item_10001_relation_14":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.5188/ijsmer.10.142","subitem_relation_type_select":"DOI"}}]},"item_10001_relation_25":{"attribute_name":"関連リンク","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"http://doi.org/10.5188/ijsmer.10.142","subitem_relation_type_select":"DOI"}}]},"item_10001_source_id_11":{"attribute_name":"NCID","attribute_value_mlt":[{"subitem_source_identifier":"AA1095475X","subitem_source_identifier_type":"NCID"}]},"item_10001_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13479725","subitem_source_identifier_type":"ISSN"}]},"item_10001_version_type_20":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Nakahara, Yuunosuke"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Ninomiya, Ryuuji"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Tagami, Michihiro"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2017-02-16"}],"displaytype":"detail","filename":"ijsmer10-2e.pdf","filesize":[{"value":"1.2 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"ijsmer10-2e.pdf","url":"https://air.repo.nii.ac.jp/record/965/files/ijsmer10-2e.pdf"},"version_id":"4c3c5270-8759-4510-95d9-3967850a9194"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Lead-free solder","subitem_subject_scheme":"Other"},{"subitem_subject":"Zn addition","subitem_subject_scheme":"Other"},{"subitem_subject":"Joint strength","subitem_subject_scheme":"Other"},{"subitem_subject":"Reaction layer","subitem_subject_scheme":"Other"},{"subitem_subject":"Joint interface structure","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Effect of Zn Addition to Sn-3Ag-5Bi Solder on Joint Strength and Joint Interface","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Effect of Zn Addition to Sn-3Ag-5Bi Solder on Joint Strength and Joint Interface"}]},"item_type_id":"10001","owner":"3","path":["683"],"pubdate":{"attribute_name":"公開日","attribute_value":"2008-04-01"},"publish_date":"2008-04-01","publish_status":"0","recid":"965","relation_version_is_last":true,"title":["Effect of Zn Addition to Sn-3Ag-5Bi Solder on Joint Strength and Joint Interface"],"weko_creator_id":"3","weko_shared_id":3},"updated":"2023-07-25T10:48:07.104541+00:00"}