{"created":"2023-07-25T10:21:46.695830+00:00","id":911,"links":{},"metadata":{"_buckets":{"deposit":"94968047-3b29-4755-a6d3-9b1d43025e31"},"_deposit":{"created_by":15,"id":"911","owners":[15],"pid":{"revision_id":0,"type":"depid","value":"911"},"status":"published"},"_oai":{"id":"oai:air.repo.nii.ac.jp:00000911","sets":["590:664:671:677"]},"author_link":[],"item_10001_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2006-03-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"2","bibliographicPageEnd":"99","bibliographicPageStart":"96","bibliographicVolumeNumber":"13","bibliographic_titles":[{"bibliographic_title":"International Journal of the Society of Materials Engineering for Resources","bibliographic_titleLang":"en"}]}]},"item_10001_description_5":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"In this paper, we report micro-structural characteristics of electroplated Cu thin films with the variation of the current density applied during the electroplating process. We evaluated the surface roughness, the crystalline texture, the resistivity, and the grain size of the thin film in a wide range of current density (50― 1000A/m2). The surface roughness and the resistivity were increased according to the increment of the current density. The <111> textured structure was also pronounced as the current density was increased. The scanning ion microscope (SIM) image of the cross-sectional samples revealed that grain size of the film prepared in a high current density was much smaller (0.05～0.5μm) than that of the thin film in a low current density (l～2μm). These results are different from the film prepared by a sputtering process, where a smooth surface was observed in a small grain-sized (<0.1μm) film.","subitem_description_language":"en","subitem_description_type":"Abstract"},{"subitem_description":"ICMR2005","subitem_description_language":"en","subitem_description_type":"Other"}]},"item_10001_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"The Society of Materilas Engineering for resources of Japan","subitem_publisher_language":"en"}]},"item_10001_relation_25":{"attribute_name":"関連情報","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.5188/ijsmer.13.96","subitem_relation_type_select":"DOI"}}]},"item_10001_version_type_20":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_1724099666130":{"attribute_name":"収録物識別子","attribute_value_mlt":[{"subitem_source_identifier":"1347-9725","subitem_source_identifier_type":"PISSN"},{"subitem_source_identifier":"AA1095475X","subitem_source_identifier_type":"NCID"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_abf2"}]},"item_creator":{"attribute_name":"作成者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"MASAI, T","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"TAKASUGI, K","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"CHOKI, K-K","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Sato, S","creatorNameLang":"en"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2017-02-16"}],"displaytype":"detail","filename":"ijsmer13-2n.pdf","filesize":[{"value":"1.3 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"ijsmer13-2n.pdf","url":"https://air.repo.nii.ac.jp/record/911/files/ijsmer13-2n.pdf"},"version_id":"68cd6840-1e22-4427-bf52-2921c0762bff"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Cu electroplating","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"thin film","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"grain size","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"current density","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Inference of Current density on Microstructure of Electroplated Cu Thin Film","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Inference of Current density on Microstructure of Electroplated Cu Thin Film","subitem_title_language":"en"}]},"item_type_id":"10001","owner":"15","path":["677"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2008-03-12"},"publish_date":"2008-03-12","publish_status":"0","recid":"911","relation_version_is_last":true,"title":["Inference of Current density on Microstructure of Electroplated Cu Thin Film"],"weko_creator_id":"15","weko_shared_id":-1},"updated":"2024-08-25T18:14:17.938656+00:00"}