{"created":"2023-07-25T10:25:33.223512+00:00","id":5944,"links":{},"metadata":{"_buckets":{"deposit":"9a5f7337-6fb5-4633-9072-5463d6d58311"},"_deposit":{"created_by":3,"id":"5944","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"5944"},"status":"published"},"_oai":{"id":"oai:air.repo.nii.ac.jp:00005944","sets":["590:629:630"]},"author_link":["17221","17212","17215","17213","17220","17222","17218","17216","17214","17211","17217","17219"],"item_10001_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2022","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"16","bibliographicVolumeNumber":"15","bibliographic_titles":[{"bibliographic_title":"MATERIALS"}]}]},"item_10001_description_5":{"attribute_name":"内容記述（抄録）","attribute_value_mlt":[{"subitem_description":"This study demonstrates that a single-crystal diamond substrate can be cut along designed lines using the diamond-saw-wire cutting method. We developed an original saw-wire fixed diamond-grain using a bronze solder with a high melting temperature. We created a unique product machine system with a high vacuum furnace and a bronze solder that contains a metallic compound. The diamond cutting mechanism employed in this study is based on the mild wear phenomenon, owing to the friction between the diamond surfaces. A linear relationship between the cutting length and wire feed distance was observed. The relationship can be approximated as y = 0.3622x, where y (mu m) is the cutting depth and x (km) is the wire feed distance. The life of the saw-wire was longer than that of the 6000 km wire feed distance and was tested by reciprocating an 8-m short wire at a speed, tension, and cutting force of 150 m/min, 1 N, and 0.2 N, respectively. A single crystal diamond substrate could be cut along the designed line, which was more than 2 mm long. The cutting speed was maintained constant at 0.36 mu m/km.","subitem_description_type":"Other"}]},"item_10001_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"MDPI"}]},"item_10001_relation_14":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.3390/ma15165524","subitem_relation_type_select":"DOI"}}]},"item_10001_relation_25":{"attribute_name":"関連リンク","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"http://dx.doi.org/10.3390/ma15165524"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"http://dx.doi.org/10.3390/ma15165524","subitem_relation_type_select":"DOI"}}]},"item_10001_rights_15":{"attribute_name":"著作権等","attribute_value_mlt":[{"subitem_rights":"© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access\narticle distributed under the terms and conditions of the Creative Commons Attribution\n(CC BY) license (http://creativecommons.org/licenses/by/4.0/)."}]},"item_10001_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"1996-1944","subitem_source_identifier_type":"ISSN"}]},"item_10001_version_type_20":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Kamiya, Osamu"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Takahashi, Mamoru"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Miyano, Yasuyuki"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Ito, Shinichi"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Nakatsu, Masanobu"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Mizuma, Hiroyuki"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Iwama, Yuichi"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Murata, Kenji"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Nanao, Junpei"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Kawano, Makoto"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Maisawa, Arata"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Kazumi, Takashi"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2023-02-23"}],"displaytype":"detail","filename":"riA_2022_23.pdf","filesize":[{"value":"37.1 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"riA_2022_23.pdf","url":"https://air.repo.nii.ac.jp/record/5944/files/riA_2022_23.pdf"},"version_id":"791a7713-f2e0-436f-af3d-51cdbf0618e4"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"diamond cutting","subitem_subject_scheme":"Other"},{"subitem_subject":" diamond saw wire","subitem_subject_scheme":"Other"},{"subitem_subject":" fixed grain saw wire","subitem_subject_scheme":"Other"},{"subitem_subject":" diamond grain","subitem_subject_scheme":"Other"},{"subitem_subject":" cutting length","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire"}]},"item_type_id":"10001","owner":"3","path":["630"],"pubdate":{"attribute_name":"公開日","attribute_value":"2023-02-23"},"publish_date":"2023-02-23","publish_status":"0","recid":"5944","relation_version_is_last":true,"title":["Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-07-25T10:39:45.597173+00:00"}