@article{oai:air.repo.nii.ac.jp:00005944,
 author = {Kamiya, Osamu and Takahashi, Mamoru and Miyano, Yasuyuki and Ito, Shinichi and Nakatsu, Masanobu and Mizuma, Hiroyuki and Iwama, Yuichi and Murata, Kenji and Nanao, Junpei and Kawano, Makoto and Maisawa, Arata and Kazumi, Takashi},
 issue = {16},
 journal = {MATERIALS},
 month = {},
 note = {This study demonstrates that a single-crystal diamond substrate can be cut along designed lines using the diamond-saw-wire cutting method. We developed an original saw-wire fixed diamond-grain using a bronze solder with a high melting temperature. We created a unique product machine system with a high vacuum furnace and a bronze solder that contains a metallic compound. The diamond cutting mechanism employed in this study is based on the mild wear phenomenon, owing to the friction between the diamond surfaces. A linear relationship between the cutting length and wire feed distance was observed. The relationship can be approximated as y = 0.3622x, where y (mu m) is the cutting depth and x (km) is the wire feed distance. The life of the saw-wire was longer than that of the 6000 km wire feed distance and was tested by reciprocating an 8-m short wire at a speed, tension, and cutting force of 150 m/min, 1 N, and 0.2 N, respectively. A single crystal diamond substrate could be cut along the designed line, which was more than 2 mm long. The cutting speed was maintained constant at 0.36 mu m/km.},
 title = {Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire},
 volume = {15},
 year = {2022}
}