| Item type |
紀要論文 / Departmental Bulletin Paper(1) |
| 公開日 |
2007-12-14 |
| タイトル |
|
|
タイトル |
＜論文＞ダイヤモンドと金属を接合させた省資源型マイクロワイヤソー |
| その他のタイトル |
|
|
その他のタイトル |
＜Original Papers＞Ecological Micro-cutting Wire Saw Bonding Diamond Grain and Metal Wire |
| 言語 |
|
|
言語 |
jpn |
| 資源タイプ |
|
|
資源タイプ識別子 |
http://purl.org/coar/resource_type/c_6501 |
|
資源タイプ |
departmental bulletin paper |
| 作成者 |
神谷, 修
内田, 貴博
木村, 光彦
石川, 唯夫
KAMIYA, Osamu
UCHIDA, Takahiro
KIMURA, Mitsuhiko
ISHIKAWA, Tadao
|
| 内容記述 |
|
|
内容記述タイプ |
Other |
|
内容記述 |
The new diamond micro cutting wire saw is capable of cutting the composite that consists from several deferent hardness materials. Previously, the slurry included the diamond grain was poured into the boundary between the metal wire and work piece. The slurry with diamond grain is consumed and contaminates the water. In order to prevent the pollution, we developed the new micro cutting wire in which the diamond grain was bonded to a Tungsten wire of 60μm diameter, by means of the specially developed solder which include a metal hydride. The diamond grains are fixed to metal wire, and therefore, are not consume. We demonstrated one application example that the new wire can cut a IC chip. |
| 出版タイプ |
|
|
出版タイプ |
VoR |
|
出版タイプResource |
http://purl.org/coar/version/c_970fb48d4fbd8a85 |
| 書誌情報 |
秋田大学工学資源学部 研究報告
巻 23,
p. 41-47,
発行日 2002-10-31
|
| ISSN |
|
|
収録物識別子タイプ |
ISSN |
|
収録物識別子 |
13457241 |
| NCID |
|
|
収録物識別子タイプ |
NCID |
|
収録物識別子 |
AA11410906 |
| 出版者 |
|
|
出版者 |
秋田大学工学資源学部 |
KJ00000048349.pdf (837.5 kB)
