@article{oai:air.repo.nii.ac.jp:00001316, author = {木村, 光彦 and 浅利, 孝一 and 後藤, 正治 and 麻生, 節夫 and 大口, 健一 and KIMURA, Mitsuhiko and ASARI, Koichi and GOTO, Shoji and ASO, Setsuo and OHGUCHI, Kenichi}, issue = {2}, journal = {素材物性学雑誌}, month = {Dec}, note = {Electrical Sialon ceramics having some contents of TiN and SKS3 metal were joined with AgCu- Ti active brazing metal layer having a thickness of 100 /l m or 400 /l m at a temperature of 1113K for 300s in a vacuum, The residual stresses on the brazed joint samples were measured in the ceramics side and the metal side by X-ray stress analysis. The linearity in 2 e -sin' ¢ diagram was confirmed for X-ray diffraction from the grinded surfaces of metal and ceramics. The residual stresses in the ceramics and metal sides of brazed joint samples indicated the characteristic distributions each other. The residual stress over several hundred MPa was measured within about 10mm from the joint interface in the metal side of brazed joint sample. The 400 /l m thickness of the brazing metal layer was especially effective to relax the residual stress of a y in the ceramics side (a y : residual stress in vertical direction to the joint interface). And when the brazing metal layer thickness was 400 /l m, the residual stress a y in the metal side showed almost zero value due to the plastic deformation of the brazing metal layer.}, pages = {36--42}, title = {導電性セラミックス/金属接合体の残留応力測定}, volume = {15}, year = {2002} }