2026-03-07T18:42:43Z https://air.repo.nii.ac.jp/oai

oai:air.repo.nii.ac.jp:00005944 2024-08-31T23:33:31Z 590:629:630

Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire Kamiya, Osamu Takahashi, Mamoru Miyano, Yasuyuki Ito, Shinichi Nakatsu, Masanobu Mizuma, Hiroyuki Iwama, Yuichi Murata, Kenji Nanao, Junpei Kawano, Makoto Maisawa, Arata Kazumi, Takashi diamond cutting diamond saw wire fixed grain saw wire diamond grain cutting length This study demonstrates that a single-crystal diamond substrate can be cut along designed lines using the diamond-saw-wire cutting method. We developed an original saw-wire fixed diamond-grain using a bronze solder with a high melting temperature. We created a unique product machine system with a high vacuum furnace and a bronze solder that contains a metallic compound. The diamond cutting mechanism employed in this study is based on the mild wear phenomenon, owing to the friction between the diamond surfaces. A linear relationship between the cutting length and wire feed distance was observed. The relationship can be approximated as y = 0.3622x, where y (mu m) is the cutting depth and x (km) is the wire feed distance. The life of the saw-wire was longer than that of the 6000 km wire feed distance and was tested by reciprocating an 8-m short wire at a speed, tension, and cutting force of 150 m/min, 1 N, and 0.2 N, respectively. A single crystal diamond substrate could be cut along the designed line, which was more than 2 mm long. The cutting speed was maintained constant at 0.36 mu m/km. journal article MDPI 2022 VoR application/pdf MATERIALS 16 15 https://air.repo.nii.ac.jp/record/5944/files/riA_2022_23.pdf http://hdl.handle.net/10295/00006256 https://air.repo.nii.ac.jp/records/5944 eng https://doi.org/10.3390/ma15165524 © 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). open access